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NOR</a></div></div></li></ul></li><li role="treeitem" aria-expanded="false"><div data-tocid="usb_display-d5856e2011" class="topicref" data-id="usb_display" data-state="not-ready"><span role="button" tabindex="0" aria-labelledby="button-expand-action usb_display-d5856e2011-link" class="wh-expand-btn"></span><div class="title"><a href="../../../topics/sdk/app/usb-display.html" id="usb_display-d5856e2011-link">USB Display 方案</a></div></div></li></ul></li><li role="treeitem" aria-expanded="false"><div data-tocid="id-d5856e2119" class="topicref" data-id="id" data-state="not-ready"><span role="button" tabindex="0" aria-labelledby="button-expand-action id-d5856e2119-link" class="wh-expand-btn"></span><div class="title"><a href="../../../topics/sdk/peripheral/peripheral-intro.html" id="id-d5856e2119-link">外设移植</a><div class="wh-tooltip"><p class="shortdesc"><span class="ph">CTP、U 盘、SD 卡、有线和无线网络</span>等外设的介绍和使用说明。</p></div></div></div></li><li role="treeitem" aria-expanded="false"><div 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<div class=" wh_topic_content body "><main role="main"><article class="- topic/topic topic" role="article" aria-labelledby="ariaid-title1"><span class="edit-link" style="font-size:12px; opacity:0.6; text-align:right; vertical-align:middle"><a target="_blank" href="http://172.16.35.88/tasks/jdssno1uvvbf2mltu9kb9v3if05d5gopuakboe8hlud18rma/edit/F:/aicdita/aicdita-cn/topics/sdk/burnsys/burn_packaged_spinor.dita">Edit online</a></span><h1 class="- topic/title title topictitle1" id="ariaid-title1">烧录内置 SPI NOR</h1><div class="date inPage">15 Jan 2024</div><div style="color: gray;">
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Read time: 1 minute(s)
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</div><div class="- topic/body body"><p class="- topic/p p" data-ofbid="d202621e19__20250121171635">对于内置 NOR 烧录方案，尤其是针对支持合封 NOR Flash 的芯片，设备生产厂商可能希望在主控芯片焊接到板子前对于合封 NOR
|
||
进行镜像数据烧录。这种离线烧录方法可以确保芯片在出厂前已经包含了必要的固件或应用程序。</p><section class="- topic/section section" id="burn_packaged_spinor__section_zfr_hgr_gdc" data-ofbid="burn_packaged_spinor__section_zfr_hgr_gdc"><h2 class="- topic/title title sectiontitle">内置 NOR 烧录原理</h2>
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<div class="- topic/p p" data-ofbid="d202621e26__20250121171635">使用外部烧录器对于合封 NOR 直接进行数据烧录的工作原理如下：<ol class="- topic/ol ol" id="burn_packaged_spinor__ol_rhp_5fr_gdc" data-ofbid="burn_packaged_spinor__ol_rhp_5fr_gdc"><li class="- topic/li li" data-ofbid="d202621e29__20250121171635">
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<p class="- topic/p p" data-ofbid="d202621e31__20250121171635">对没有烧录过启动程序的空片，芯片上电时，由于 BROM 启动失败，直接进入了升级模式。</p>
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</li><li class="- topic/li li" data-ofbid="d202621e34__20250121171635">
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<p class="- topic/p p" data-ofbid="d202621e36__20250121171635">在升级模式中，BROM 会设置将合封 NOR 的 CS、CLK、MOSI 和 MISO 引脚映射到外部。</p>
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</li><li class="- topic/li li" data-ofbid="d202621e39__20250121171635">
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<p class="- topic/p p" data-ofbid="d202621e41__20250121171635">此时外部设备可将芯片当做一颗普通 SPI NOR Flash 进行读写访问。</p>
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</li></ol></div>
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</section><section class="- topic/section section" id="burn_packaged_spinor__section_hh2_jgr_gdc" data-ofbid="burn_packaged_spinor__section_hh2_jgr_gdc"><h2 class="- topic/title title sectiontitle">准备硬件</h2>
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<div class="- topic/p p" data-ofbid="d202621e50__20250121171635">
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<ol class="- topic/ol ol" id="burn_packaged_spinor__ul_hyl_kgr_gdc" data-ofbid="burn_packaged_spinor__ul_hyl_kgr_gdc"><li class="- topic/li li" data-ofbid="d202621e53__20250121171635"><strong class="+ topic/ph hi-d/b ph b">使用合适的烧录座</strong><p class="- topic/p p" data-ofbid="d202621e56__20250121171635">为了进行芯片的离线烧录，特别是在内置 NOR
|
||
闪存的情况下，使用一个合适的烧录座是至关重要的一步。下面将详细介绍如何选择合适的烧录座以及如何使用它来准备芯片进行烧录。</p><p class="- topic/p p" data-ofbid="d202621e58__20250121171635">烧录座的选择主要依赖于芯片的封装类型和尺寸。芯片可能有多种封装，如
|
||
QFN68, QFN88, QFN100，注意根据芯片的封装信息，使用合适的烧录座。</p><div class="- topic/p p" data-ofbid="d202621e60__20250121171635">例如，对于 QFN68
|
||
封装的芯片，其具体尺寸信息为 7x7x0.85 mm，引脚间距为 0.35 mm ，应准备一个能够匹配这些规格的烧录座。<figure class="- topic/fig fig fignone" id="burn_packaged_spinor__fig_ic3_pfr_gdc" data-ofbid="burn_packaged_spinor__fig_ic3_pfr_gdc"><br/><div class="imagecenter"><img class="- topic/image image imagecenter" id="burn_packaged_spinor__image_nc3_pfr_gdc" src="../../../images/sdk/socket.png" alt="socket"/></div><br/><figcaption data-caption-side="bottom" class="- topic/title title figcapcenter"><span class="figtitleprefix fig--title-label">图<span class="fig--title-label-number"> 1</span><span class="fig--title-label-punctuation">. </span></span><span class="fig--title">烧录座示例</span></figcaption></figure></div><p class="- topic/p p" data-ofbid="d202621e68__20250121171635">确保烧录座可以精确地容纳并引出芯片的所有必要信号线。将芯片对准烧录座，轻轻下压，确保所有引脚都与烧录座的触点良好接触。检查连接是否牢固且无短路风险。</p></li><li class="- topic/li li" data-ofbid="d202621e70__20250121171635"><strong class="+ topic/ph hi-d/b ph b">使用烧录座烧录子板</strong><div class="- topic/p p" data-ofbid="d202621e73__20250121171635">一旦选择了合适的烧录座，即可将芯片放置到烧录座中，并确保所有接触点都正确无误地连接，具体流程如下：<ol class="- topic/ol ol" type="a" id="burn_packaged_spinor__ol_vhv_1hr_gdc" data-ofbid="burn_packaged_spinor__ol_vhv_1hr_gdc"><li class="- topic/li li" data-ofbid="d202621e76__20250121171635">
|
||
<p class="- topic/p p" data-ofbid="d202621e78__20250121171635">设计烧录子板。</p>
|
||
<p class="- topic/p p" data-ofbid="d202621e81__20250121171635">要使用外部烧录器进行烧录，还需要针对烧录器设计一个专用的烧录子板，通过该子板将烧录器、烧录座以及主控芯片对应的信号连接起来。</p>
|
||
<div class="- topic/p p" data-ofbid="d202621e84__20250121171635">对于主控芯片而言，需要处理的相关引脚信息如下：<div class="table-container"><table class="- topic/table table longtable colwidths-given docutils align-default frame-all" id="burn_packaged_spinor__table_bw2_5gr_gdc" data-ofbid="burn_packaged_spinor__table_bw2_5gr_gdc" data-cols="2"><caption class="- topic/title title tablecap" data-caption-side="top" data-is-repeated="true"><span class="table--title-label">表<span class="table--title-label-number"> 1</span><span class="table--title-label-punctuation">. </span></span><span class="table--title"></span></caption><colgroup><col style="width:46.948356807511736%"/><col style="width:53.051643192488264%"/></colgroup><thead class="- topic/thead thead"><tr class="- topic/row"><th class="- topic/entry entry colsep-1 rowsep-1" id="burn_packaged_spinor__table_bw2_5gr_gdc__entry__1">引脚</th><th class="- topic/entry entry colsep-0 rowsep-1" id="burn_packaged_spinor__table_bw2_5gr_gdc__entry__2">功能</th></tr></thead><tbody class="- topic/tbody tbody"><tr class="- topic/row"><td class="- topic/entry entry colsep-1 rowsep-1" headers="burn_packaged_spinor__table_bw2_5gr_gdc__entry__1">VCC33_IO</td><td class="- topic/entry entry colsep-0 rowsep-1" headers="burn_packaged_spinor__table_bw2_5gr_gdc__entry__2">3.3V 供电</td></tr><tr class="- topic/row"><td class="- topic/entry entry colsep-1 rowsep-1" headers="burn_packaged_spinor__table_bw2_5gr_gdc__entry__1">GND</td><td class="- topic/entry entry colsep-0 rowsep-1" headers="burn_packaged_spinor__table_bw2_5gr_gdc__entry__2">接地</td></tr><tr class="- topic/row"><td class="- topic/entry entry colsep-1 rowsep-1" headers="burn_packaged_spinor__table_bw2_5gr_gdc__entry__1">PB6</td><td class="- topic/entry entry colsep-0 rowsep-1" headers="burn_packaged_spinor__table_bw2_5gr_gdc__entry__2">FLASH_CS</td></tr><tr class="- topic/row"><td class="- topic/entry entry colsep-1 rowsep-1" headers="burn_packaged_spinor__table_bw2_5gr_gdc__entry__1">PB7</td><td class="- topic/entry entry colsep-0 rowsep-1" headers="burn_packaged_spinor__table_bw2_5gr_gdc__entry__2">FLASH_MISO</td></tr><tr class="- topic/row"><td class="- topic/entry entry colsep-1 rowsep-1" headers="burn_packaged_spinor__table_bw2_5gr_gdc__entry__1">PB8</td><td class="- topic/entry entry colsep-0 rowsep-1" headers="burn_packaged_spinor__table_bw2_5gr_gdc__entry__2">FLASH_MOSI</td></tr><tr class="- topic/row"><td class="- topic/entry entry colsep-1 rowsep-1" headers="burn_packaged_spinor__table_bw2_5gr_gdc__entry__1">PB9</td><td class="- topic/entry entry colsep-0 rowsep-1" headers="burn_packaged_spinor__table_bw2_5gr_gdc__entry__2">FLASH_CLK</td></tr><tr class="- topic/row"><td class="- topic/entry entry colsep-1 rowsep-1" headers="burn_packaged_spinor__table_bw2_5gr_gdc__entry__1">PLL_XI</td><td class="- topic/entry entry colsep-0 rowsep-1" headers="burn_packaged_spinor__table_bw2_5gr_gdc__entry__2">外部晶振</td></tr><tr class="- topic/row"><td class="- topic/entry entry colsep-1 rowsep-0" headers="burn_packaged_spinor__table_bw2_5gr_gdc__entry__1">PLL_XO</td><td class="- topic/entry entry colsep-0 rowsep-0" headers="burn_packaged_spinor__table_bw2_5gr_gdc__entry__2">外部晶振</td></tr></tbody></table></div><div class="- topic/note note note note_note" id="burn_packaged_spinor__note_yws_5gr_gdc" data-ofbid="burn_packaged_spinor__note_yws_5gr_gdc"><span class="note__title">注：</span>
|
||
<ul class="- topic/ul ul simple" id="burn_packaged_spinor__ul_bht_5gr_gdc" data-ofbid="burn_packaged_spinor__ul_bht_5gr_gdc"><li class="- topic/li li" data-ofbid="d202621e141__20250121171635">
|
||
<p class="- topic/p p" data-ofbid="d202621e143__20250121171635">所有的 VCC33_IO 都要接上电源。</p>
|
||
</li><li class="- topic/li li" data-ofbid="d202621e146__20250121171635">
|
||
<p class="- topic/p p" data-ofbid="d202621e148__20250121171635">有些芯片不需要外部晶振，则可以不需要理会 PLL_XI/PLL_XO 引脚</p>
|
||
</li></ul>
|
||
</div></div>
|
||
</li><li class="- topic/li li" data-ofbid="d202621e153__20250121171635">
|
||
<div class="- topic/p p" data-ofbid="d202621e155__20250121171635">将主控芯片的升级引脚默认拉低，可以反复使用烧录器烧录芯片：<div class="table-container"><table class="- topic/table table longtable colwidths-given docutils align-default frame-all" id="burn_packaged_spinor__table_wzl_dhr_gdc" data-ofbid="burn_packaged_spinor__table_wzl_dhr_gdc" data-cols="2"><caption></caption><colgroup><col style="width:25.90673575129534%"/><col style="width:74.09326424870466%"/></colgroup><thead class="- topic/thead thead"><tr class="- topic/row"><th class="- topic/entry entry colsep-1 rowsep-1" id="burn_packaged_spinor__table_wzl_dhr_gdc__entry__1">引脚</th><th class="- topic/entry entry colsep-0 rowsep-1" id="burn_packaged_spinor__table_wzl_dhr_gdc__entry__2">功能</th></tr></thead><tbody class="- topic/tbody tbody"><tr class="- topic/row"><td class="- topic/entry entry colsep-1 rowsep-0" headers="burn_packaged_spinor__table_wzl_dhr_gdc__entry__1">PA0</td><td class="- topic/entry entry colsep-0 rowsep-0" headers="burn_packaged_spinor__table_wzl_dhr_gdc__entry__2">默认的升级按键引脚</td></tr></tbody></table></div></div>
|
||
<p class="- topic/p p" data-ofbid="d202621e174__20250121171635">设置升级引脚拉低的作用，是因为默认情况下，如果 NOR 中有合法的启动程序，
|
||
上电时会直接启动，不会进入升级模式。若需要进入升级模式，则通过拉低升级按键对应的引脚，启动时软件检测后进入。</p>
|
||
<p class="- topic/p p" data-ofbid="d202621e177__20250121171635">注意，升级按键引脚默认是 PA0，但是软件可配置修改为其他引脚。如果要烧录的软件已经修改了所检测的升级按键引脚，
|
||
则烧录子板也需对应修改，不然无法支持重复烧录，即空片第一次烧录可成功，再次烧录无法检测到 NOR Flash。</p>
|
||
</li><li class="- topic/li li" data-ofbid="d202621e180__20250121171635">
|
||
<p class="- topic/p p" data-ofbid="d202621e182__20250121171635"><strong class="+ topic/ph hi-d/b ph b">连接烧录器</strong>：<strong class="+ topic/ph hi-d/b ph b">烧录器的相关连接信息，请参考所使用的烧录器手册。</strong>
|
||
</p>
|
||
</li></ol></div></li></ol>
|
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</div>
|
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</section><section class="- topic/section section" id="burn_packaged_spinor__section_l3k_hhr_gdc" data-ofbid="burn_packaged_spinor__section_l3k_hhr_gdc"><h2 class="- topic/title title sectiontitle">烧录器烧录</h2>
|
||
|
||
<div class="- topic/p p" data-ofbid="d202621e197__20250121171635">使用烧录器进行烧录时，需要将焊接好烧录座的烧录子板连接到烧录器上。进行烧录时，将主控芯片放入到烧录座中，扣紧后上电，即可进行烧录。<figure class="- topic/fig fig fignone" id="burn_packaged_spinor__fig_jqj_ghr_gdc" data-ofbid="burn_packaged_spinor__fig_jqj_ghr_gdc"><br/><div class="imagecenter"><img class="- topic/image image imagecenter" id="burn_packaged_spinor__image_utc_ghr_gdc" src="../../../images/sdk/programmer.png" width="288" alt="programmer"/></div><br/><figcaption data-caption-side="bottom" class="- topic/title title figcapcenter"><span class="figtitleprefix fig--title-label">图<span class="fig--title-label-number"> 2</span><span class="fig--title-label-punctuation">. </span></span><span class="fig--title">烧录器示例</span></figcaption></figure></div>
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<div class=" wh_topic_toc "><div class="wh_topic_label">在本页上</div><ul><li class="section-item"><div class="section-title"><a href="#burn_packaged_spinor__section_zfr_hgr_gdc" data-tocid="burn_packaged_spinor__section_zfr_hgr_gdc">内置 NOR 烧录原理</a></div></li><li class="section-item"><div class="section-title"><a href="#burn_packaged_spinor__section_hh2_jgr_gdc" data-tocid="burn_packaged_spinor__section_hh2_jgr_gdc">准备硬件</a></div></li><li class="section-item"><div class="section-title"><a href="#burn_packaged_spinor__section_l3k_hhr_gdc" data-tocid="burn_packaged_spinor__section_l3k_hhr_gdc">烧录器烧录</a></div></li></ul></div>
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